Epoxy Resin
Form :
Liquid
Molecular Weight :
392.9
Molecular Formula :
C21H25CLO5
Description :
The liquid epoxy resin. It is utilised in electronic devices, electrical parts, structural adhesives, and fiber-reinforced plastics. In A Cool Place, Save.
Epoxy Resin, known for its strong bonding properties, enhances the performance of Butyl Vinyl Ether and N-tert-butylacrylamide in creating durable and flexible polymer systems.
